We offer bulk micromachining and surface micromachining for silicon substrates.
These processes are used to produce three- dimensional-structures like micro-electromechanical systems (MEMS) or micromachinery.
Deep Trenches or Holes
A high integration density of 3- dimensional structures is possible with deep reactive ion etch. One of the main advantages compared to wet etch is the independence of the silicon orientation.
Wafer through etch
With DRIE it is possible to etch completely through wafer. Structures like membranes can be built with this process.
Double- Sided Lithography
With Double-sided lithography it is possible to process both sides of wafer with exact registration of the structures on both sides.
Through Silicon Via
With this you can make an electrical connection between frontside CMOS structures and backside structures. In the very near future we can provide this service to you.
Please contact mems(at)heimannsensor.com
for more details.